Chii chinonzi Bonding Waya?
Waya yekubatanidza iwaya inobatanidza zvidimbu zviviri zvemidziyo, kazhinji yekudzivirira njodzi. Kuti usunge madhiramu maviri, waya yekubatanidza inofanira kushandiswa, inova waya yemhangura ine zvipikiri zvengwena.
Kubatanidza waya dzegoridhe kunopa nzira yekubatanidza mukati memapakeji anotungamira magetsi zvakanyanya, anenge akakura kupfuura mamwe ma solders. Pamusoro pezvo, waya dzegoridhe dzinoshivirira kuoxidation zvakanyanya kana tichienzanisa nezvimwe zvinhu zvewaya uye dzakapfava kupfuura dzakawanda, izvo zvakakosha kune nzvimbo dzinonzwa kutonhora.
Kubatanidza waya inzira yekugadzira kubatana kwemagetsi pakati pema semiconductors (kana mamwe ma integrated circuits) nema silicon chips uchishandisa waya dzekubatanidza, idzo dziri waya dzakanaka dzakagadzirwa nezvinhu zvakaita segoridhe nealuminium. Maitiro maviri akajairika ndeekuti gold ball bonding uye aluminium wedge bonding.
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