Iyini I-Bonding Wire?
Intambo yokubopha intambo ehlanganisa izingcezu ezimbili zemishini, ngokuvamile evikela ubungozi. Ukuze ubophe izigubhu ezimbili, kufanele kusetshenziswe ucingo lokubopha, okuwucingo lwethusi oluneziqeshana zengwenya.
Ukubopha ucingo lwegolide kunikeza indlela yokuxhuma ngaphakathi kwamaphakheji aqhuba ugesi kakhulu, cishe ngobukhulu obukhulu kunezinye izihlanganisi. Ngaphezu kwalokho, izintambo zegolide zinokubekezelela okuphezulu kokubola uma kuqhathaniswa nezinye izinto zocingo futhi zithambile kuneziningi, okubalulekile ezindaweni ezibucayi.
Ukubopha ngentambo kuyinqubo yokudala ukuxhumana kukagesi phakathi kwama-semiconductor (noma amanye amasekethe ahlanganisiwe) nama-silicon chips kusetshenziswa izintambo zokubopha, okuyizintambo ezincane ezenziwe ngezinto ezifana negolide ne-aluminium. Izinqubo ezimbili ezivame kakhulu ukubopha ngebhola legolide kanye nokubopha nge-aluminium wedge.
I-Shenzhen Hasung Precious Metals Equipment Technology Co., Ltd. yinkampani yobunjiniyela bemishini etholakala eningizimu yeShayina, edolobheni elihle nelikhula ngokushesha kwezomnotho, iShenzhen. Le nkampani ingumholi kwezobuchwepheshe emkhakheni wemishini yokushisa nokukhipha izinsimbi eziyigugu kanye nemboni yezinto ezintsha.
Ulwazi lwethu oluqinile kubuchwepheshe bokuphonswa kwe-vacuum lusenza sikwazi ukukhonza amakhasimende ezimboni ukuze afake insimbi exutshwe kakhulu, i-platinum-rhodium alloy edingekayo nge-vacuum ephezulu, igolide nesiliva, njll.
Ucingo: +86 17898439424
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WhatsApp: 0086 17898439424
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